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1ŒŽ22`23“ú 2025”N “d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³ ‡“¯Œ¤‹†‰ï (”­•\ŽÒF‰ª–{C‹{ìC‹{èCƒLƒ€Cƒ‰C––‰iC–L“cC’·’JCƒ‹ƒlƒbƒ^
3ŒŽ18`20“ú —ߘa7”N“d‹CŠw‰ï“d‹CŠw‰ï‘S‘‘å‰ï (”­•\ŽÒF‰ª–{CƒLƒ€C––‰iC–L“cC’·’JCƒ‰CŠŽRC–Ø–{C”‘ŠâCâ–{


—ߘa6”N
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1ŒŽ19`20“ú 2024”N “d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³ ‡“¯Œ¤‹†‰ï (”­•\ŽÒF‰œ‘ºC¥àVC‰ª–{CŽÂèC‹{ìC‹{è)
1ŒŽ22`23“ú Mate2024 (”­•\ŽÒF¬”—)
3ŒŽ14`16“ú —ߘa6”N“d‹CŠw‰ï‘S‘‘å‰ï (”­•\ŽÒFƒ„ƒICŽÂèC‹{ìC‹{èCƒLƒ€C––‰iC–L“cC’·’JC‹gˆä)
6ŒŽ30`7ŒŽ4“ú 2024 International Conference of Dielectrics (ICD)@ƒtƒ‰ƒ“ƒX(”­•\ŽÒFŽÂèC‹{ìCƒLƒ€)
6ŒŽ7“ú ΖûŠw‰ï ‘æ44‰ñ ≖û•ª‰È‰ïŒ¤‹†”­•\‰ï i”­•\ŽÒF––‰ij
8ŒŽ4`7“ú 2024 International Conference on the Properties and Applications of Dielectric Materials (ICPADM)@ƒ^ƒC@i”­•\ŽÒF––‰ij
9ŒŽ2`4“ú —ߘa6”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï i”­•\ŽÒFƒ„ƒIC‹{ìCƒLƒ€C’·’JCƒ‰j
9ŒŽ4`6“ú —ߘa6”N “d‹CŠw‰ï “d—̓Gƒlƒ‹ƒM[•”–å‘å‰ï (”­•\ŽÒF‹{ìC–L“c)
9ŒŽ25`27“ú ‘æ55‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ (”­•\ŽÒF‰ª–{CŽÂèC‹{èC¬”—)
10ŒŽ6`9“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)2024@ƒAƒƒŠƒJ(”­•\ŽÒF‰ª–{C‹{è)
10ŒŽ20`24“ú International Confernce on Condition Monitoring and Diagnosis(CMD)2024@ŠØ‘(”­•\ŽÒFƒ„ƒICƒLƒ€C‹{ìC–L“cC’·’JC¬”—)


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1ŒŽ21`22“ú 2023”N@“d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³‡“¯Œ¤‹†‰ï (”­•\ŽÒF‘P“cC¥àVC’·”ö)
3ŒŽ14`17“ú —ߘa5”N“d‹CŠw‰ï‘S‘‘å‰ï (”­•\ŽÒF‘P“cC‰œ‘ºCŽ™‹ÊC¥àVC‰ª–{CŽÂú±C‹{ìC‹{èCƒ„ƒI)
6ŒŽ9“ú ΖûŠw‰ï ‘æ43‰ñ ≖û•ª‰È‰ïŒ¤‹†”­•\‰ï i”­•\ŽÒF“y]j
6ŒŽ16“ú “d‹CŠw‰ï —U“dâ‰Þ—¿Œ¤‹†‰ï i”­•\ŽÒF¬”—j 
6ŒŽ18“ú`21“ú 2023 IEEE Electrical Insulation Conference (EIC)—ƒJƒiƒ_ (”­•\ŽÒF‰œ‘ºC¥àV) 
6ŒŽ25“ú`28“ú 2023 IEEE International Conference on Dielectric Liquids (ICDL)—ƒAƒƒŠƒJ (”­•\ŽÒF‰ª–{) 
8ŒŽ6“ú`10“ú 2023 IEEE International Conference on High Voltage Engineering and Power Systems (ICHVEPS )—ƒCƒ“ƒhƒlƒVƒA (”­•\ŽÒF¬”—Eµ‘Òu‰‰) 
8ŒŽ16“ú`19“ú 2023 IEEE International Conference on Electrical Engineering & Computing Convergence and Applications (ICEE-CCA ) (”­•\ŽÒF¬”—Eµ‘Òu‰‰) 
8ŒŽ27“ú`9ŒŽ1“ú 2023 International Symposium on High Voltage Engineering (ISH)—ƒCƒMƒŠƒX (”­•\ŽÒFƒ„ƒICƒ‹ƒlC‹{ì) 
9ŒŽ4“ú`6“ú —ߘa5”N “d‹CŠw‰ï “d—̓Gƒlƒ‹ƒM[•”–å‘å‰ï (ŽQ‰ÁŽÒF¬”—EÀ’·)
9ŒŽ7“ú`9“ú —ߘa5”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï i”­•\ŽÒFƒ„ƒIC‰œ‘ºC¥àVC‰ª–{CŽÂèC‹{ìj 
9ŒŽ24“ú`28“ú 2023 International Symposium on Electrical Insulating Materials (ISEIM) (”­•\ŽÒFƒ„ƒIC‰ª–{CŽÂèC‹{ì) 
10ŒŽ15“ú`19“ú 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena(CEIDP)—ƒAƒƒŠƒJ i”­•\ŽÒF‹{èj
11ŒŽ20“ú`21“ú 2023 International Symposium on Applied Engineering and Science(SAES)—ƒ}ƒŒ[ƒVƒA i”­•\ŽÒFƒ‹ƒlC‹{ìj


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1ŒŽ21`22“ú 2022”N@“d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³‡“¯Œ¤‹†‰ï(”­•\ŽÒFûM»C›‘ã)
3ŒŽ21`23“ú —ߘa4”N“d‹CŠw‰ï‘S‘‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z(”­•\ŽÒF¬”—CˆäãC¼–ØC‘P“cC¥àVC’·”ö)
5ŒŽ29“ú`6ŒŽ2“ú 2022 IEEE International Conference on Dielectric Liquids (ICDL)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFûM»j
6ŒŽ19`23“ú 2022 IEEE Electrical Insulation Conference (EIC)i”­•\ŽÒF¬”—C›‘ãjCi˜_•¶“ŠeFŽ™‹ÊC¥àVj
7ŒŽ3`7“ú 2022 IEEE International Conference on Dielectric (ICD)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF¬”—C‘P“cj
9ŒŽ5`7“ú 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF‰œ‘ºj
9ŒŽ7`9“ú ‘æ53‰ñ “d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€i”­•\ŽÒFƒ}ƒnƒ‰ƒiC‘P“cCûM»C‰œ‘ºCŽ™‹ÊC¥àV)
9ŒŽ13`15“ú —ߘa4”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïi”­•\ŽÒF‹v–ìj
9ŒŽ13`15“ú —ߘa4”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïi”­•\ŽÒF¬”—Cƒ‹ƒlCƒ„ƒICûM»C›‘ãC¼–ØC‰œ‘ºC¥àVj
11ŒŽ13`18“ú 2022 International Conference on Condition Monitoring and Diagnosis (CMD)i”­•\ŽÒFƒ„ƒICƒ‹ƒlC‘P“cCûM»C›‘ãC‰œ‘ºC¥àVj
12ŒŽ12`15“ú 2022 International Joint Symposium on Applied Engineering and Sciences (SAES)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF‘P“cCûM»C›‘ãC¼–ØC‰œ‘ºC¥àVj
 


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1ŒŽ22`23“ú 2021”N@“d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³‡“¯Œ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“z(”­•\ŽÒF’|”V“à)
3ŒŽ3“ú “d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ïi”­•\ŽÒF¬”—j
3ŒŽ9`11“ú —ߘa3”N“d‹CŠw‰ï‘S‘‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z(”­•\ŽÒF¬”—C•C“cCŽR“cCˆäãC’|”V“àCéŒãCûM»C¼–ØC‘P“cC›‘ãC‰Ô“c)
6ŒŽ7`28“ú 2021 IEEE Electrical Insulation Conference (EIC)yƒIƒ“ƒ‰ƒCƒ“zi’®u‚Ì‚Ýj
7ŒŽ12`14“ú 2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM) yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF•C“cj
8ŒŽ24`26“ú —ߘa3”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF‹v–ìj
9ŒŽ1`3“ú —ߘa3”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFˆäãC’|”V“àCûM»C¼–ØC‘P“cj
9ŒŽ13`15“ú ‘æ52‰ñ “d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFˆäãC’|”V“àCûM»j
9ŒŽ24`25“ú 2021”N“x “d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïyƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFûM»j
11ŒŽ21`25“ú 2021 International Symposium on High Voltage Engineering (ISH)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFûM»j
12ŒŽ5`8“ú 2021 International Joint Symposium on Applied Engineering and Sciences (SAES)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF’|”V“àC‘P“cCûM»C¼–Øj
12ŒŽ12`16“ú 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)yƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFˆäãC’|”V“àC‘P“cCûM»C¼–Øj
12ŒŽ17“ú 2021”N@“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒFûM»j
12ŒŽ20“ú 2021”N@“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“zi”­•\ŽÒF¼–Øj


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1ŒŽ24`25“ú 2020”N@“d‹CŠw‰ï@•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[^‚“dˆ³^—U“dEâ‰Þ—¿‡“¯Œ¤‹†‰ïi—“’•z‰@j
3ŒŽ9“ú 2020”N@“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ïyŠJÂ͒†Ž~C˜_•¶‚ÍŒöŠJz
3ŒŽ11`13“ú —ߘa2”N“d‹CŠw‰ï‘S‘‘å‰ïyŠJÂ͒†Ž~C˜_•¶‚ÍŒöŠJz
3ŒŽ24`26“ú 11th International Conference on Integrated Power Electronics Systems(CIPS2020)yŠJÂ͒†Ž~C˜_•¶‚ÍŒöŠJz
6ŒŽ22`7ŒŽ3“ú 2020Electrical Insulation Conference (EIC2020)yƒIƒ“ƒ‰ƒCƒ“z
7ŒŽ6`31“ú 2020 International Conference on Dielectrics (ICD2020)yƒIƒ“ƒ‰ƒCƒ“z
9ŒŽ1`3“ú —ߘa2”N@“d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z
9ŒŽ9`11“ú —ߘa2”N@“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z
9ŒŽ13`17“ú 2020 International Symposium on Electrical Insulating Materials (ISEIM)yƒIƒ“ƒ‰ƒCƒ“z
9ŒŽ26`27“ú 2020”N“x@“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z
10ŒŽ25`28“ú The 2020 International Conference on Condition Monitoring and Diagnosis (CMD2020)yƒIƒ“ƒ‰ƒCƒ“z
11ŒŽ20“ú 2020”N@“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“z
12ŒŽ18“ú 2020”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“z


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1ŒŽ25`26“ú •½¬31”N “d‹CŠw‰ï@•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[^‚“dˆ³^—U“dEâ‰Þ—¿‡“¯Œ¤‹†‰ïi—‰‚”ü‘哇j
3ŒŽ12“ú`14“ú •½¬31”N“d‹CŠw‰ï‘S‘‘å‰ï
4ŒŽ17`19“ú 2019 International Conference on Electronics Packaging (ICEP)
4ŒŽ24`26“ú International Workshop on Integrated Power Packaging 2019 (IWIPP)
6ŒŽ16`19“ú Electrical Insulation Conference (EIC2019)
6ŒŽ23`27“ú IEEE International Conference on Dielectric Liquids (ICDL2019)
8ŒŽ26`30“ú The 21th International Symposium on High Voltage Engineering(ISH2019)
9ŒŽ3`4“ú —ߘaŒ³”N“d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï
9ŒŽ3`6“ú —ߘaŒ³”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï
9ŒŽ9`10“ú —ߘaŒ³”N“x“d‹CE“dŽqEî•ñŠÖŒWŠw‰ï“ŒŠCŽx•”˜A‡‘å‰ï
9ŒŽ17`19“ú ‘æ50‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€
9ŒŽ27`28“ú 2019”N“x“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï
10ŒŽ1`4“ú The 2nd International Conference on High Voltage Engineering and Power System 2019(ICHVEPS)
10ŒŽ7`8“ú The 2019 International Symposium on Advanced Power Packaging (ISAPP2019)
10ŒŽ13`16“ú 5th International Conference on Electric Power Equipment ? Switching Technology(ICEPE-ST 2019)
10ŒŽ20“ú`23“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena(CEIDP2019)
12ŒŽ16“ú 2019”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï
12ŒŽ20“ú 2019”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï


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1ŒŽ26“ú`27“ú   •½¬30”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ïi—‰®‹v“‡j
3ŒŽ2“ú •½¬30”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ï
3ŒŽ14“ú`16“ú •½¬30”N@“d‹CŠw‰ï‘S‘‘å‰ï
6ŒŽ17`20“ú IEEE Electrical Insulation Conference (EIC2018)
7ŒŽ1`5“ú International Conference on Dielectrics (ICD2018)
8ŒŽ28`30“ú •½¬30”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–å‘å‰ï
9ŒŽ4“ú`5“ú •½¬30”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï
9ŒŽ5`7“ú Œö‰vŽÐ’c–@l“ú–{ƒZƒ‰ƒ~ƒbƒNƒX‹¦‰ï@‘æ31‰ñH‹GƒVƒ“ƒ|ƒWƒEƒ€
9ŒŽ10“ú`12“ú ‘æ49‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€
9ŒŽ12“ú`14“ú •½¬30”N@“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–åiB•”–åj‘å‰ï
9ŒŽ23“ú`26“ú International Conference on Condition Monitoring and Diagonosis (CMD) 2018
9ŒŽ23`28“ú 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV2018)
9ŒŽ27“ú`28“ú •½¬30”N“x@(‘æ71‰ñ)@“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï
10ŒŽ21“ú`24“ú Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2018
11ŒŽ2“ú`3“ú The 11th International Workshop on High Voltage engineering (IWHV2018)
12ŒŽ5“ú •½¬30”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï
12ŒŽ14“ú •½¬30”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï

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1ŒŽ26“ú`27“ú   •½¬29”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï
1ŒŽ31“ú`2ŒŽ1“ú ‘æ23‰ñuƒGƒŒƒNƒgƒƒjƒNƒX‚É‚¨‚¯‚éƒ}ƒCƒNƒÚ‡EŽÀ‘•‹ZpvƒVƒ“ƒ|ƒWƒEƒ€
3ŒŽ15“ú`‚P‚V“ú •½¬‚Q‚X”N“d‹CŠw‰ï‘S‘‘å‰ï
4ŒŽ5`7“ú IEEE International Workshop On Integrated Power Packaging (IWIPP2017)
6ŒŽ25“ú`6ŒŽ29“ú International Conference on Dielectric Liquids 2017
8ŒŽ28“ú`9ŒŽ1“ú  20th. International Symposium on High-Voltage Engineering(ISH)2017
8ŒŽ29“ú`31“ú •½¬29”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–åiD•”–åj‘å‰ï
9ŒŽ5“ú`9ŒŽ7“ú •½¬29”N“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–åiB•”–åj‘å‰ï
9ŒŽ12“ú`15“ú 8th International Symposium on Electrical Insulating Materials(ISEIM2017)
9ŒŽ19“ú`20“ú •½¬29”N“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–åiA•”–åj‘å‰ï
9ŒŽ27“ú`28“ú •½¬29”N“x@(‘æ70‰ñ)@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï
10ŒŽ2“ú`5“ú International Conference on High Voltage Engineering and Power Systems (ICHVEPS2017)
12ŒŽ15“ú  ÃŽ~ŠíŒ¤‹†‰ï@2017
12ŒŽ19“ú  —U“dEâ‰Þ—¿Œ¤‹†‰ï@2017

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1ŒŽ28“ú`29“ú   •ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï
3ŒŽ4“ú •½¬28”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ï
3ŒŽ16“ú`18“ú •½¬28”N“d‹CŠw‰ï‘S‘‘å‰ï
3ŒŽ22`24“ú ‘æ30‰ñƒGƒŒƒNƒgƒƒjƒNƒXŽÀ‘•Šw‰ïtŠúu‰‰‘å‰ï
7ŒŽ3“ú`‚V“ú International Conference on Dielectrics 2016
8ŒŽ30“ú`9ŒŽ1“ú •½¬28”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–åiD•”–åj‘å‰ï
8ŒŽ31“ú`9ŒŽ2“ú ‘æ47‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€
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9ŒŽ11“ú`16“ú 21st International Conference on Gas Discharge and Their Applictions 2016
9ŒŽ18“ú`23“ú The 27th international Symposium on Discharges and Electrical Insulation in Vacuum iISDEIV) 2016
9ŒŽ25“ú`28“ú International Conference on Condition Monitoring and Diagonosis (CMD) 2016
9ŒŽ29“ú`30“ú •½¬28”N“x@(‘æ69‰ñ)@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï
10ŒŽ16“ú`19“ú Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2016
11ŒŽ4“ú`5“ú 10th International Workshop on High Voltage Engineering (IWHV)
11ŒŽ22`25“ú TENCON 2016
12ŒŽ9“ú ÃŽ~ŠíŒ¤‹†‰ï 2016
12ŒŽ19“ú —U“dEâ‰Þ—¿Œ¤‹†‰ï

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3ŒŽ24“ú`26“ú •½¬27”N“d‹CŠw‰ï‘S‘‘å‰ï
6ŒŽ7“ú`10“ú The 33rd Electrical Insulation Conference, Seattle
6ŒŽ9“ú`12“ú  The 11th Power Electronics & Drive Systems, Sydney
6ŒŽ12“ú ‘æ35‰ñ≖û•ª‰È‰ïŒ¤‹†”­•\‰ï
7ŒŽ19“ú`22“ú The 11th International Conference on the Properties and Applications of Dielectric Materials, Sydney
8ŒŽ23“ú`28“ú 19th International Symposium on High Voltage Engineering (ISH)
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10ŒŽ18“ú`21“ú  2015 IEEE Conference on Electrical Insulation and Dielectric Phenomena, Ann Arbor 
10ŒŽ25`28“ú 18th International Conference on Electrical Machines and Systems (ICEMS)
11ŒŽ19`21“ú 2015 Korea-Japan Joint Symposium on Electrical Discharge and High Voltage Engineering
11ŒŽ27`29“ú International Symposium on EcoTopia Science 2015
12ŒŽ11“ú   ÃŽ~ŠíŒ¤‹†‰ï
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3ŒŽ18“ú`20“ú •½¬26”N“d‹CŠw‰ï‘S‘‘å‰ï
5ŒŽ18`21“ú The 2014 International Power Electronics Conference ?ECCE ASIA- (IPEC2014)
6ŒŽ1“ú`5“ú ‚hnternational ‚rymposium on ‚dlectrical ‚hnsulating ‚laterials
6ŒŽ8“ú`11“ú Electrical Insulation Conference
6ŒŽ12“ú •ú“dŒ¤‹†‰ï
6ŒŽ13“ú ‘æ34‰ñ≖û•ª‰È‰ïŒ¤‹†”­•\‰ï
6ŒŽ29“ú`7ŒŽ3“ú International Conference on Development and Learning
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9ŒŽ21“ú`9ŒŽ25“ú Condition Monitoring Diagnosis
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9ŒŽ28“ú`10ŒŽ3“ú International ‚rymposium on Discharge and ‚dlectrical ‚hnsulation in Vacuum
10ŒŽ19“ú`10ŒŽ22“ú Conference on Electrical Insulation and Dielectric Phenomena
10ŒŽ23“ú`10ŒŽ25“ú The Korean Institute of Electrical Engineers
11ŒŽ7“ú`11ŒŽ8“ú International Workshop on High Voltage Engineering
11ŒŽ12“ú`11ŒŽ13“ú International collaboration Symposium on Information, Production and Systems
12ŒŽ9`11“ú 2nd IEEE Conference on Power Engineering and Renewable Energy 2014(ICPERE)
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4ŒŽ22“ú`4ŒŽ25“ú IEEE PEDS 2013
5ŒŽ29`31“ú The 12thInternational Electrical Insulation Conference (INSUCON2013)
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6ŒŽ30“ú`7ŒŽ4“ú IEEE ICSD Bologna 2013
8ŒŽ25“ú`8ŒŽ30“ú ISH 2013
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10ŒŽ20“ú`10ŒŽ23“ú 2013 IEEE CEIDP
11ŒŽ11`13“ú The 7th IPS International Collaboration Symposium
11ŒŽ25“ú`11ŒŽ27“ú ‘æ44‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€
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6ŒŽ10`13“ú 2012 IEEE International Symposium on Electrical Insulation (ISEI2012)
7ŒŽ8`12“ú The International Conference on Electrical Engineering 2012(ICEE2012)
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4ŒŽ19`22“ú The 2010 IEEE PES Transmission and Distribution Conference and Exposition
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6ŒŽ6`10“ú 2010 IEEE International Symposium on Electrical Insulation (ISEI2010)
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7ŒŽ4“ú`9“ú International Conference on Solid Dielectrics (ICSD)
7ŒŽ11`14“ú 16th International Conference on Electrical Engineering (ICEE2010)
7ŒŽ21`23“ú The 2010 International Power Electronics Conference ?ECCE ASIA- (IPEC-Sapporo 2010)
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9ŒŽ6“ú`11“ú  International Conference on Condition Monitoring and Diagnosis(CMD)
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11ŒŽ12“ú`13“ú International Workshop on High Voltage EngineeringiIWHVj
11ŒŽ15“ú`17“ú ‘æ41‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€
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6ŒŽ8`11“ú 20th International Conference on Electricity Distribution
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7ŒŽ5`9“ú The International Conference on Electrical Engineering 2009(ICEE2009)
7ŒŽ19“ú`23“ú The 9th International Conference on Properties and Applications of Dielectric Materials(ICPADM2009)
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8ŒŽ24“ú`28“ú 16th International Symposium on High Voltage Engineering  (ISH)
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10ŒŽ26`30“ú IEEE Transmission&Distribution Conference in Asia 2009
10ŒŽ18`21“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2009)
11ŒŽ5“úC6“ú 2009 Korea-Japan Joint Symposium on Electrical Discharge and High Voltage Engineering
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11ŒŽ26`27“ú IEEJ-EIT Joint symposium advanced Technology inpower Systems
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4ŒŽ21`24“ú 2008 International Conference on Condition Monitoring and Diagonosis(CMD 2008)(Beijing,China)
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7ŒŽ6`10“ú The International conference on Electrical Engineering 2008(ICEE2008)
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9ŒŽ7`11“ú 2008 International Symposium on Electrical Insulating Materials (ISEIM2008)
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10ŒŽ14`17“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena(CEIDP2007), (Vancouver, British Columbia Canada )
11ŒŽ15`17“ú 2007 Japan-Korea Joint Symposium on Electrical Discharge and High Voltage Engineering, (Tokyo, Japan )
11ŒŽ21`22“ú ‘æ38‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€
11ŒŽ23`25“ú International Symposium on EcoTopia ScienceiISETS2007j, (Nagoya, Japan )
11ŒŽ26, 27“ú “d‹CŠw‰ï@•ú“d^ŠJ••یì^‚“dˆ³‡“¯Œ¤‹†‰ï@iL“‡Œ§î•ñƒvƒ‰ƒUFL“‡j
12ŒŽ13“ú “d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï@i“d‹CŠw‰ï–{•”F“Œ‹žj


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3ŒŽ3“ú “d‹CŠw‰ï—U“d¥â‰Þ—¿E“dü¥ƒP[ƒuƒ‹‡“¯Œ¤‹†‰ï
3ŒŽ15`17“ú •½¬18”N“d‹CŠw‰ï‘S‘‘å‰ï@i‰¡•l‘—§‘åŠwF‰¡•lj
4ŒŽ2`5“ú International Conference on Condition Monitoring and Diagnosis (CMD2006)
5ŒŽ14`18“ú 27th International Power Modulator Symposium and 2006 High-Voltage Workshop IEEE International Power Modulator Conference
6ŒŽ26`30“ú 8th International Conference on Properties and Applications of Dielectric Materials(ICPADM 2006)@(Bali, Indonesia)
8ŒŽ21, 22“ú •½¬18”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï@iŒF–{‘åŠwFŒF–{j
9ŒŽ13`15“ú •½¬18”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[iBj•”–å‘å‰ï@i—®‹…‘åŠwF‰«“êj
9ŒŽ25`29“ú 22nd International Symposium on Discharges and Electrical Insulation in Vaccum(ISDEIV) 2006@(Matue, Japan)
9ŒŽ28C29“ú •½¬18”N“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï@i‹{è‘åŠwF‹{èj
10ŒŽ12C13“ú ‘æ37‰ñ@“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€@iç—t‘åŠwFç—tj
10ŒŽ15`18“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2006)
10ŒŽ16`18“ú 13th Asian Conference on Electrical Discharge (ACED 2006)@(Sapporo, Japan)
11ŒŽ14`15“ú Joint Technical Meeting on Electrical Discharges, Static Apparatus, Switching and Protecting Engineering and High Voltage Engineering, IEEJ
12ŒŽ13`15“ú “ú–{‹@ŠBŠw‰ï@‘æ15‰ñŒð’ÊE•¨—¬•”–å‘å‰ïiTRANSLOG2006j/‘æ13‰ñ“S“¹‹Zp˜A‡ƒVƒ“ƒ|ƒWƒEƒ€iJ|RAIL2006) (ìèŽsŽY‹ÆU‹»‰ïŠÙFìè)


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3ŒŽ17`19“ú •½¬17”N“d‹CŠw‰ï‘S‘‘å‰ï@i“¿“‡‘åŠwF“¿“‡j
6ŒŽ5`9“ú 2005 International Symposium on Electrical Insulating Materials(ISEIM2005)@(Kitakyushu, Japan)
8ŒŽ8`9“ú International Symposium on EcoTopia Science 2005
8ŒŽ10`12“ú •½¬17”N“d‹CŠw‰ï@“d—̓Gƒlƒ‹ƒM[•”–å‘å‰ï@i‘åã‘åŠwF‘åãj
8ŒŽ22, 23“ú •½¬17”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï@i“ú–{‘åŠwF“Œ‹žj
8ŒŽ25`29“ú 14th International Symposium on High Voltage Engineering,@(Beijing, China)
9ŒŽ29, 30“ú •½¬17”N“x“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï@i•Ÿ‰ªH‹Æ‘åŠwF•Ÿ‰ªj
10ŒŽ16`19“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2005)
11ŒŽ3, 4“ú 2005 Korea-Japan Joint Symposium on Electrical Discharge and High Voltage Engineering@(Ansan, Korea)
11ŒŽ9, 10“ú “d‹CŠw‰ï@•ú“d^ŠJ••یì^‚“dˆ³‡“¯Œ¤‹†‰ï@iƒTƒ“ƒ|[ƒgƒz[ƒ‹‚¼F‚¼j
12ŒŽ7`9“ú “ú–{‹@ŠBŠw‰ï@‘æ14‰ñŒð’ÊE•¨—¬•”–å‘å‰ï@iìèŽsŽY‹ÆU‹»‰ïŠÙFìèj
12ŒŽ14“ú “d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï@i“d‹CŠw‰ï–{•”F“Œ‹žj


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1ŒŽ27“ú “d‹CŠw‰ï@—U“dEâ‰Þ—¿^“düEƒP[ƒuƒ‹‡“¯Œ¤‹†‰ï
3ŒŽ17`19“ú “d‹CŠw‰ï‘S‘‘å‰ïiÂŽRŠw‰@‘åŠwF‘Š–ÍŒ´j
3ŒŽ27`28“ú International Workshop on Insulation Diagnosis for Rotating Machines (IDRM)
3ŒŽ28`4ŒŽ2“ú International Symposium on Gaseous Dielectrics X
6ŒŽ25“ú “d‹CŠw‰ï—U“dEâ‰Þ—¿Œ¤‹†‰ï (–k‹ãB‘Û‰ï‹cêF•Ÿ‰ª)
8ŒŽ5`7“ú “d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïi–¼ŒÃ‰®‘åŠwFˆ¤’mj
8ŒŽ29`31“ú “d‹CŠÖŒWŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïiå‘ä‘ÛƒZƒ“ƒ^[F‹{éj
9ŒŽ9“ú “d‹CŠw‰ï@“d‹C‹ZpŽjŒ¤‹†‰ï
9ŒŽ19`22“ú 2004 IEEE International Symposium on Electrical Insulation (ISEI2004)
9ŒŽ27`28“ú “d‹CŠÖ˜AŠw‰ï‹ãBŽx•”˜A‡‘å‰ïiŽ­Ž™“‡‘åŠwFŽ­Ž™“‡j
10ŒŽ7, 8“ú International Workshop on High Voltage Engineering (IWHV'04)@(Sapporo, Japan)
10ŒŽ17`20“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2004)
10ŒŽ31`11ŒŽ3“ú International Conference on Electrical Machines and Systems 2004 (ICEMS2004)
11ŒŽ17, 18“ú ‘æ35‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€@iŽÅ‰YH‹Æ‘åŠwF“Œ‹žj
11ŒŽ19`22“ú 12th Asian Conference on Electrical Discharge (ACED2004)@(Shenzhen, China)


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3ŒŽ17`19“ú “d‹CŠw‰ï‘S‘‘å‰ï(“Œ–kŠw‰@‘åŠw)
6ŒŽ1`5“ú ICPADM(–¼ŒÃ‰®)
8ŒŽ6`8“ú “d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï(“Œ‹ž“d‹@‘åŠw)
8ŒŽ25`26“ú “d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï(’·‰ª‹Zp‰ÈŠw‘åŠw)
8ŒŽ25`29“ú ISH(ƒIƒ‰ƒ“ƒ_@ƒfƒ‹ƒtƒg)
9ŒŽ3`5“ú  3rd IASTED International Conference Power and Energy Systems (Euro PES)
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3ŒŽ5“ú “d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï
3ŒŽ26“ú`29“ú “d‹CŠw‰ï‘S‘‘å‰ï(“Œ–kŠw‰@‘åŠw)
4ŒŽ 2002 Doble Client Conference
4ŒŽ7`10“ú 2002 IEEE International Symposium on Electrical Insulation (ISEI2002)
7ŒŽ International Workshop on Insulation Diagnosis for Rotating Machines
8ŒŽ7“ú`9“ú “d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï
9ŒŽ11“ú “d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï
9ŒŽ11`13“ú Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï
9ŒŽ20“ú ‹ãBE“d—Í‹ZpŒ¤‹†‰ï
9ŒŽ26,27“ú ‹ãBŽx•”‘å‰ï
10ŒŽ20`24“ú IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2002)
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2ŒŽ27“ú “d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï
3ŒŽ21`23“ú “d‹CŠw‰ï‘S‘‘å‰ïi–¼ŒÃ‰®‘åŠwFˆ¤’mj
5ŒŽ21`25“ú International Symposium on Gaseous Dielectrics IX
8ŒŽ1`3“ú “d‹CŠw‰ï“d—̓Gƒlƒ‹ƒM[•”–å‘å‰ïi“Œ–k‘åŠwF‹{éj
8ŒŽ1`4“ú 2001 Asia-pacific Radio Science Conference (AP-RASCf01)
8ŒŽ20`26“ú ISH (ƒCƒ“ƒh)
9ŒŽ21`23“ú “d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïiˆ¤•Q‘åŠwFˆ¤•Qj
10ŒŽ5`6“ú “d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïi²‰ê‘åŠwF²‰êj
11ŒŽ1`2“ú JKƒVƒ“ƒ|ƒWƒEƒ€i‹{èŒö—§‘åŠwF‹{èj
11ŒŽ8`9“ú •ú“dŠw‰ïCŽáŽèƒZƒ~ƒi[i‚¤‚݂̒†“¹ƒzƒeƒ‹F•Ÿ‰ªj
11ŒŽ8`9“ú IWHVi’¹Žæj
11ŒŽ8`9“ú “d‹CŠw‰ï@•ú“d^ŠJ••یì^‚“dˆ³‡“¯Œ¤‹†‰ï
11ŒŽ19`22“ú 2001 International Symposium on Electrical Insulating Materialsi•ºŒÉj
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4ŒŽ2`5“ú ISEI2000iAnaheim, CAFUSAj
4ŒŽ10`12“ú IHVW2000inewport bearch, CAFUSAj
6ŒŽ21`26“ú ICPADMiX'ian Jiaotong UniversityF’†‘j
7ŒŽ24`28“ú ICEE2000i–k‹ãB‘Û‰ï‹cêF•Ÿ‰ªj
8ŒŽ2`4“ú “d‹CŠw‰ï“d—̓Gƒlƒ‹ƒM[•”–å‘å‰ïi–kŠC“¹‘åŠwF–kŠC“¹j
9ŒŽ7`8“ú “d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïi–kŠC“¹‘åŠwF–kŠC“¹j
9ŒŽ13`14“ú “d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïi‹ãBŽY‹Æ‘åŠwF•Ÿ‰ªj
9ŒŽ18`23“ú ISDEIViX'ian Jiaotong UniversityF’†‘j
10ŒŽ5`6“ú JKƒVƒ“ƒ|ƒWƒEƒ€iŠØ‘j
10ŒŽ15`17“ú ‰F’ˆ‰ÈŠw‹Zp˜A‡u‰‰‰ïiƒAƒNƒƒX•Ÿ‰ªF•Ÿ‰ªj
11ŒŽ1`2“ú IWHVi’¹Žæj
11ŒŽ6`7“ú 10th Asian Conference on Electrical Discharge (ACED2000)
11ŒŽ16`17“ú “d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€iŽR‰¤‹¤Ï‰ïŠÙF’·–ìj
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