@Šw‰ï“ú’ö |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ22`23“ú |
2025”N “d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³ ‡“¯Œ¤‹†‰ï (”•\ŽÒF‰ª–{C‹{ìC‹{èCƒLƒ€Cƒ‰C––‰iC–L“cC’·’JCƒ‹ƒlƒbƒ^ |
3ŒŽ18`20“ú |
—ߘa7”N“d‹CŠw‰ï“d‹CŠw‰ï‘S‘‘å‰ï (”•\ŽÒF‰ª–{CƒLƒ€C––‰iC–L“cC’·’JCƒ‰CŠŽRC–Ø–{C”‘ŠâCâ–{ |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ19`20“ú |
2024”N “d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³ ‡“¯Œ¤‹†‰ï (”•\ŽÒF‰œ‘ºC¥àVC‰ª–{CŽÂèC‹{ìC‹{è) |
1ŒŽ22`23“ú |
Mate2024 (”•\ŽÒF¬”—) |
3ŒŽ14`16“ú |
—ߘa6”N“d‹CŠw‰ï‘S‘‘å‰ï (”•\ŽÒFƒ„ƒICŽÂèC‹{ìC‹{èCƒLƒ€C––‰iC–L“cC’·’JC‹gˆä) |
6ŒŽ30`7ŒŽ4“ú |
2024 International Conference of Dielectrics (ICD)@ƒtƒ‰ƒ“ƒX(”•\ŽÒFŽÂèC‹{ìCƒLƒ€) |
6ŒŽ7“ú |
ΖûŠw‰ï ‘æ44‰ñ ≖û•ª‰È‰ïŒ¤‹†”•\‰ï i”•\ŽÒF––‰ij |
8ŒŽ4`7“ú |
2024 International Conference on the Properties and Applications of Dielectric
Materials (ICPADM)@ƒ^ƒC@i”•\ŽÒF––‰ij |
9ŒŽ2`4“ú |
—ߘa6”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï i”•\ŽÒFƒ„ƒIC‹{ìCƒLƒ€C’·’JCƒ‰j |
9ŒŽ4`6“ú |
—ߘa6”N “d‹CŠw‰ï “d—̓Gƒlƒ‹ƒM[•”–å‘å‰ï (”•\ŽÒF‹{ìC–L“c) |
9ŒŽ25`27“ú |
‘æ55‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ (”•\ŽÒF‰ª–{CŽÂèC‹{èC¬”—) |
10ŒŽ6`9“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)2024@ƒAƒƒŠƒJ(”•\ŽÒF‰ª–{C‹{è) |
10ŒŽ20`24“ú |
International Confernce on Condition Monitoring and Diagnosis(CMD)2024@ŠØ‘(”•\ŽÒFƒ„ƒICƒLƒ€C‹{ìC–L“cC’·’JC¬”—) |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ21`22“ú |
2023”N@“d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³‡“¯Œ¤‹†‰ï (”•\ŽÒF‘P“cC¥àVC’·”ö) |
3ŒŽ14`17“ú |
—ߘa5”N“d‹CŠw‰ï‘S‘‘å‰ï (”•\ŽÒF‘P“cC‰œ‘ºCŽ™‹ÊC¥àVC‰ª–{CŽÂú±C‹{ìC‹{èCƒ„ƒI) |
6ŒŽ9“ú |
ΖûŠw‰ï ‘æ43‰ñ ≖û•ª‰È‰ïŒ¤‹†”•\‰ï i”•\ŽÒF“y]j |
6ŒŽ16“ú |
“d‹CŠw‰ï —U“dâ‰Þ—¿Œ¤‹†‰ï i”•\ŽÒF¬”—j |
6ŒŽ18“ú`21“ú |
2023 IEEE Electrical Insulation Conference (EIC)—ƒJƒiƒ_ (”•\ŽÒF‰œ‘ºC¥àV) |
6ŒŽ25“ú`28“ú |
2023 IEEE International Conference on Dielectric Liquids (ICDL)—ƒAƒƒŠƒJ (”•\ŽÒF‰ª–{) |
8ŒŽ6“ú`10“ú |
2023 IEEE International Conference on High Voltage Engineering and Power
Systems (ICHVEPS )—ƒCƒ“ƒhƒlƒVƒA (”•\ŽÒF¬”—Eµ‘Òu‰‰) |
8ŒŽ16“ú`19“ú |
2023 IEEE International Conference on Electrical Engineering & Computing
Convergence and Applications (ICEE-CCA ) (”•\ŽÒF¬”—Eµ‘Òu‰‰) |
8ŒŽ27“ú`9ŒŽ1“ú |
2023 International Symposium on High Voltage Engineering (ISH)—ƒCƒMƒŠƒX (”•\ŽÒFƒ„ƒICƒ‹ƒlC‹{ì) |
9ŒŽ4“ú`6“ú |
—ߘa5”N “d‹CŠw‰ï “d—̓Gƒlƒ‹ƒM[•”–å‘å‰ï (ŽQ‰ÁŽÒF¬”—EÀ’·) |
9ŒŽ7“ú`9“ú |
—ߘa5”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï i”•\ŽÒFƒ„ƒIC‰œ‘ºC¥àVC‰ª–{CŽÂèC‹{ìj |
9ŒŽ24“ú`28“ú |
2023 International Symposium on Electrical Insulating Materials (ISEIM)
(”•\ŽÒFƒ„ƒIC‰ª–{CŽÂèC‹{ì) |
10ŒŽ15“ú`19“ú |
2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena(CEIDP)—ƒAƒƒŠƒJ
i”•\ŽÒF‹{èj |
11ŒŽ20“ú`21“ú |
2023 International Symposium on Applied Engineering and Science(SAES)—ƒ}ƒŒ[ƒVƒA
i”•\ŽÒFƒ‹ƒlC‹{ìj |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ21`22“ú |
2022”N@“d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³‡“¯Œ¤‹†‰ï(”•\ŽÒFûM»C›‘ã) |
3ŒŽ21`23“ú |
—ߘa4”N“d‹CŠw‰ï‘S‘‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z(”•\ŽÒF¬”—CˆäãC¼–ØC‘P“cC¥àVC’·”ö) |
5ŒŽ29“ú`6ŒŽ2“ú |
2022 IEEE International Conference on Dielectric Liquids (ICDL)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFûM»j |
6ŒŽ19`23“ú |
2022 IEEE Electrical Insulation Conference (EIC)i”•\ŽÒF¬”—C›‘ãjCi˜_•¶“ŠeFŽ™‹ÊC¥àVj |
7ŒŽ3`7“ú |
2022 IEEE International Conference on Dielectric (ICD)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF¬”—C‘P“cj |
9ŒŽ5`7“ú |
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF‰œ‘ºj |
9ŒŽ7`9“ú |
‘æ53‰ñ “d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€i”•\ŽÒFƒ}ƒnƒ‰ƒiC‘P“cCûM»C‰œ‘ºCŽ™‹ÊC¥àV) |
9ŒŽ13`15“ú |
—ߘa4”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïi”•\ŽÒF‹v–ìj |
9ŒŽ13`15“ú |
—ߘa4”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïi”•\ŽÒF¬”—Cƒ‹ƒlCƒ„ƒICûM»C›‘ãC¼–ØC‰œ‘ºC¥àVj |
11ŒŽ13`18“ú |
2022 International Conference on Condition Monitoring and Diagnosis (CMD)i”•\ŽÒFƒ„ƒICƒ‹ƒlC‘P“cCûM»C›‘ãC‰œ‘ºC¥àVj |
12ŒŽ12`15“ú |
2022 International Joint Symposium on Applied Engineering and Sciences
(SAES)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF‘P“cCûM»C›‘ãC¼–ØC‰œ‘ºC¥àVj |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ22`23“ú |
2021”N@“d‹CŠw‰ï —U“dEâ‰Þ—¿/•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[/‚“dˆ³‡“¯Œ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“z(”•\ŽÒF’|”V“à) |
3ŒŽ3“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ïi”•\ŽÒF¬”—j |
3ŒŽ9`11“ú |
—ߘa3”N“d‹CŠw‰ï‘S‘‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z(”•\ŽÒF¬”—C•C“cCŽR“cCˆäãC’|”V“àCéŒãCûM»C¼–ØC‘P“cC›‘ãC‰Ô“c) |
6ŒŽ7`28“ú |
2021 IEEE Electrical Insulation Conference (EIC)yƒIƒ“ƒ‰ƒCƒ“zi’®u‚Ì‚Ýj |
7ŒŽ12`14“ú |
2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM) yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF•C“cj |
8ŒŽ24`26“ú |
—ߘa3”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF‹v–ìj |
9ŒŽ1`3“ú |
—ߘa3”N “d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFˆäãC’|”V“àCûM»C¼–ØC‘P“cj |
9ŒŽ13`15“ú |
‘æ52‰ñ “d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFˆäãC’|”V“àCûM»j |
9ŒŽ24`25“ú |
2021”N“x “d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïyƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFûM»j |
11ŒŽ21`25“ú |
2021 International Symposium on High Voltage Engineering (ISH)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFûM»j |
12ŒŽ5`8“ú |
2021 International Joint Symposium on Applied Engineering and Sciences
(SAES)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF’|”V“àC‘P“cCûM»C¼–Øj |
12ŒŽ12`16“ú |
2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena
(CEIDP)yƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFˆäãC’|”V“àC‘P“cCûM»C¼–Øj |
12ŒŽ17“ú |
2021”N@“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒFûM»j |
12ŒŽ20“ú |
2021”N@“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“zi”•\ŽÒF¼–Øj |
1ŒŽ24`25“ú |
2020”N@“d‹CŠw‰ï@•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[^‚“dˆ³^—U“dEâ‰Þ—¿‡“¯Œ¤‹†‰ïi—“’•z‰@j |
3ŒŽ9“ú |
2020”N@“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ïyŠJÂ͒†Ž~C˜_•¶‚ÍŒöŠJz |
3ŒŽ11`13“ú |
—ߘa2”N“d‹CŠw‰ï‘S‘‘å‰ïyŠJÂ͒†Ž~C˜_•¶‚ÍŒöŠJz |
3ŒŽ24`26“ú |
11th International Conference on Integrated Power Electronics Systems(CIPS2020)yŠJÂ͒†Ž~C˜_•¶‚ÍŒöŠJz |
6ŒŽ22`7ŒŽ3“ú |
2020Electrical Insulation Conference (EIC2020)yƒIƒ“ƒ‰ƒCƒ“z |
7ŒŽ6`31“ú |
2020 International Conference on Dielectrics (ICD2020)yƒIƒ“ƒ‰ƒCƒ“z |
9ŒŽ1`3“ú |
—ߘa2”N@“d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z |
9ŒŽ9`11“ú |
—ߘa2”N@“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z |
9ŒŽ13`17“ú |
2020 International Symposium on Electrical Insulating Materials (ISEIM)yƒIƒ“ƒ‰ƒCƒ“z |
9ŒŽ26`27“ú |
2020”N“x@“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïyƒIƒ“ƒ‰ƒCƒ“z |
10ŒŽ25`28“ú |
The 2020 International Conference on Condition Monitoring and Diagnosis
(CMD2020)yƒIƒ“ƒ‰ƒCƒ“z |
11ŒŽ20“ú |
2020”N@“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“z |
12ŒŽ18“ú |
2020”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ïyƒIƒ“ƒ‰ƒCƒ“z |
1ŒŽ25`26“ú |
•½¬31”N “d‹CŠw‰ï@•ú“dEƒvƒ‰ƒYƒ}Eƒpƒ‹ƒXƒpƒ[^‚“dˆ³^—U“dEâ‰Þ—¿‡“¯Œ¤‹†‰ïi—‰‚”ü‘哇j |
3ŒŽ12“ú`14“ú |
•½¬31”N“d‹CŠw‰ï‘S‘‘å‰ï |
4ŒŽ17`19“ú |
2019 International Conference on Electronics Packaging (ICEP) |
4ŒŽ24`26“ú |
International Workshop on Integrated Power Packaging 2019 (IWIPP) |
6ŒŽ16`19“ú |
Electrical Insulation Conference (EIC2019) |
6ŒŽ23`27“ú |
IEEE International Conference on Dielectric Liquids (ICDL2019) |
8ŒŽ26`30“ú |
The 21th International Symposium on High Voltage Engineering(ISH2019) |
9ŒŽ3`4“ú |
—ߘaŒ³”N“d‹CŠw‰ï Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï |
9ŒŽ3`6“ú |
—ߘaŒ³”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï |
9ŒŽ9`10“ú |
—ߘaŒ³”N“x“d‹CE“dŽqEî•ñŠÖŒWŠw‰ï“ŒŠCŽx•”˜A‡‘å‰ï |
9ŒŽ17`19“ú |
‘æ50‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ27`28“ú |
2019”N“x“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï |
10ŒŽ1`4“ú |
The 2nd International Conference on High Voltage Engineering and Power
System 2019(ICHVEPS) |
10ŒŽ7`8“ú |
The 2019 International Symposium on Advanced Power Packaging (ISAPP2019) |
10ŒŽ13`16“ú |
5th International Conference on Electric Power Equipment ? Switching Technology(ICEPE-ST 2019) |
10ŒŽ20“ú`23“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena(CEIDP2019) |
12ŒŽ16“ú |
2019”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
12ŒŽ20“ú |
2019”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
1ŒŽ26“ú`27“ú |
•½¬30”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ïi—‰®‹v“‡j |
3ŒŽ2“ú |
•½¬30”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ14“ú`16“ú |
•½¬30”N@“d‹CŠw‰ï‘S‘‘å‰ï |
6ŒŽ17`20“ú |
IEEE Electrical Insulation Conference (EIC2018) |
7ŒŽ1`5“ú |
International Conference on Dielectrics (ICD2018) |
8ŒŽ28`30“ú |
•½¬30”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–å‘å‰ï |
9ŒŽ4“ú`5“ú |
•½¬30”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï |
9ŒŽ5`7“ú |
Œö‰vŽÐ’c–@l“ú–{ƒZƒ‰ƒ~ƒbƒNƒX‹¦‰ï@‘æ31‰ñH‹GƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ10“ú`12“ú |
‘æ49‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ12“ú`14“ú |
•½¬30”N@“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–åiB•”–åj‘å‰ï |
9ŒŽ23“ú`26“ú |
International Conference on Condition Monitoring and Diagonosis (CMD) 2018 |
9ŒŽ23`28“ú |
28th International Symposium on Discharges and Electrical Insulation in
Vacuum (ISDEIV2018) |
9ŒŽ27“ú`28“ú |
•½¬30”N“x@(‘æ71‰ñ)@“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï |
10ŒŽ21“ú`24“ú |
Conference on
Electrical Insulation and Dielectric Phenomena (CEIDP) 2018 |
11ŒŽ2“ú`3“ú |
The 11th International Workshop on High Voltage engineering (IWHV2018) |
12ŒŽ5“ú |
•½¬30”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
12ŒŽ14“ú |
•½¬30”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
1ŒŽ26“ú`27“ú |
•½¬29”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï |
1ŒŽ31“ú`2ŒŽ1“ú |
‘æ23‰ñuƒGƒŒƒNƒgƒƒjƒNƒX‚É‚¨‚¯‚éƒ}ƒCƒNƒÚ‡EŽÀ‘•‹ZpvƒVƒ“ƒ|ƒWƒEƒ€ |
3ŒŽ15“ú`‚P‚V“ú |
•½¬‚Q‚X”N“d‹CŠw‰ï‘S‘‘å‰ï |
4ŒŽ5`7“ú |
IEEE International Workshop On Integrated Power Packaging (IWIPP2017) |
6ŒŽ25“ú`6ŒŽ29“ú |
International Conference on Dielectric Liquids 2017 |
8ŒŽ28“ú`9ŒŽ1“ú |
20th. International Symposium on High-Voltage Engineering(ISH)2017 |
8ŒŽ29“ú`31“ú |
•½¬29”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–åiD•”–åj‘å‰ï |
9ŒŽ5“ú`9ŒŽ7“ú |
•½¬29”N“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–åiB•”–åj‘å‰ï |
9ŒŽ12“ú`15“ú |
8th International Symposium on Electrical Insulating Materials(ISEIM2017) |
9ŒŽ19“ú`20“ú |
•½¬29”N“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–åiA•”–åj‘å‰ï |
9ŒŽ27“ú`28“ú |
•½¬29”N“x@(‘æ70‰ñ)@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï |
10ŒŽ2“ú`5“ú |
International Conference on High Voltage Engineering and Power Systems (ICHVEPS2017) |
12ŒŽ15“ú |
ÃŽ~ŠíŒ¤‹†‰ï@2017 |
12ŒŽ19“ú |
—U“dEâ‰Þ—¿Œ¤‹†‰ï@2017 |
1ŒŽ28“ú`29“ú |
•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï |
3ŒŽ4“ú |
•½¬28”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ16“ú`18“ú |
•½¬28”N“d‹CŠw‰ï‘S‘‘å‰ï |
3ŒŽ22`24“ú |
‘æ30‰ñƒGƒŒƒNƒgƒƒjƒNƒXŽÀ‘•Šw‰ïtŠúu‰‰‘å‰ï |
7ŒŽ3“ú`‚V“ú |
International Conference on Dielectrics 2016 |
8ŒŽ30“ú`9ŒŽ1“ú |
•½¬28”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–åiD•”–åj‘å‰ï |
8ŒŽ31“ú`9ŒŽ2“ú |
‘æ47‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ5“ú`6“ú |
•½¬28”N“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–åiA•”–åj‘å‰ï |
9ŒŽ7“ú`9“ú |
•½¬28”N“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–åiB•”–åj‘å‰ï |
9ŒŽ11“ú`16“ú |
21st International Conference on Gas Discharge and Their Applictions 2016 |
9ŒŽ18“ú`23“ú |
The 27th international Symposium on Discharges and Electrical Insulation
in Vacuum iISDEIV) 2016 |
9ŒŽ25“ú`28“ú |
International Conference on Condition Monitoring and Diagonosis (CMD) 2016 |
9ŒŽ29“ú`30“ú |
•½¬28”N“x@(‘æ69‰ñ)@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï |
10ŒŽ16“ú`19“ú |
Conference on
Electrical Insulation and Dielectric Phenomena (CEIDP) 2016 |
11ŒŽ4“ú`5“ú |
10th International Workshop on High Voltage Engineering (IWHV) |
11ŒŽ22`25“ú |
TENCON 2016 |
12ŒŽ9“ú |
ÃŽ~ŠíŒ¤‹†‰ï 2016 |
12ŒŽ19“ú |
—U“dEâ‰Þ—¿Œ¤‹†‰ï |
1ŒŽ29“ú`30“ú |
•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³ ‡“¯Œ¤‹†‰ï |
3ŒŽ13“ú |
•½¬27”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ24“ú`26“ú |
•½¬27”N“d‹CŠw‰ï‘S‘‘å‰ï |
6ŒŽ7“ú`10“ú |
The 33rd Electrical Insulation Conference, Seattle |
6ŒŽ9“ú`12“ú |
The 11th Power Electronics & Drive Systems, Sydney |
6ŒŽ12“ú |
‘æ35‰ñ≖û•ª‰È‰ïŒ¤‹†”•\‰ï |
7ŒŽ19“ú`22“ú |
The 11th International Conference on the Properties and Applications of
Dielectric Materials, Sydney |
8ŒŽ23“ú`28“ú |
19th International Symposium on High Voltage Engineering (ISH) |
8ŒŽ25“ú`27“ú |
•½¬27”N“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–åiB•”–åj‘å‰ï |
9ŒŽ2“ú`4“ú |
•½¬27”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–åiD•”–åj‘å‰ï |
9ŒŽ3“ú`5“ú |
‘æ46‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ17“ú`18“ú |
•½¬27”N“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–åiA•”–åj‘å‰ï |
10ŒŽ18“ú`21“ú |
2015 IEEE Conference on Electrical Insulation and Dielectric Phenomena,
Ann Arbor |
10ŒŽ25`28“ú |
18th International Conference on Electrical Machines and Systems (ICEMS) |
11ŒŽ19`21“ú |
2015 Korea-Japan Joint Symposium on Electrical Discharge and High Voltage
Engineering |
11ŒŽ27`29“ú |
International Symposium on EcoTopia Science 2015 |
12ŒŽ11“ú |
ÃŽ~ŠíŒ¤‹†‰ï |
12ŒŽ22“ú |
—U“dE≌¤‹†‰ï |
1ŒŽ23“ú`24“ú |
•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³ ‡“¯Œ¤‹†‰ï |
3ŒŽ6`7“ú |
•½¬26”N“d‹CŠw‰ï@“d—Í‹Zp/“d—ÍŒn“/”¼“±‘Ì“d—͕ϊ·‡“¯Œ¤‹†‰ï |
3ŒŽ18“ú`20“ú |
•½¬26”N“d‹CŠw‰ï‘S‘‘å‰ï |
5ŒŽ18`21“ú |
The 2014 International Power Electronics Conference ?ECCE ASIA- (IPEC2014) |
6ŒŽ1“ú`5“ú |
‚hnternational ‚rymposium on ‚dlectrical ‚hnsulating ‚laterials |
6ŒŽ8“ú`11“ú |
Electrical Insulation Conference |
6ŒŽ12“ú |
•ú“dŒ¤‹†‰ï |
6ŒŽ13“ú |
‘æ34‰ñ≖û•ª‰È‰ïŒ¤‹†”•\‰ï |
6ŒŽ29“ú`7ŒŽ3“ú |
International Conference on Development and Learning |
8ŒŽ21“ú`8ŒŽ22“ú |
•½¬26”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å(A•”–å) ‘å‰ï |
8ŒŽ26“ú`8ŒŽ28“ú |
•½¬26”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å(D•”–å) ‘å‰ï |
9ŒŽ10“ú`9ŒŽ12“ú |
•½¬26”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å(B•”–å) ‘å‰ï |
9ŒŽ18`19“ú |
•½¬26”N“x“d‹CEî•ñŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï |
9ŒŽ21“ú`9ŒŽ25“ú |
Condition Monitoring Diagnosis |
9ŒŽ25“ú`9ŒŽ26“ú |
Condition Monitoring Diagnosis Workshop |
9ŒŽ28“ú`10ŒŽ3“ú |
International ‚rymposium on Discharge and ‚dlectrical ‚hnsulation in Vacuum |
10ŒŽ19“ú`10ŒŽ22“ú |
Conference on Electrical Insulation and Dielectric Phenomena |
10ŒŽ23“ú`10ŒŽ25“ú |
The Korean Institute of Electrical Engineers |
11ŒŽ7“ú`11ŒŽ8“ú |
International Workshop on High Voltage Engineering |
11ŒŽ12“ú`11ŒŽ13“ú |
International collaboration Symposium on Information, Production and Systems |
12ŒŽ9`11“ú |
2nd IEEE Conference on Power Engineering and Renewable Energy 2014(ICPERE) |
12ŒŽ12“ú |
•½¬26”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ28“ú`29“ú |
•½¬24”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï |
3ŒŽ20“ú`22“ú |
•½¬25”N“d‹CŠw‰ï‘S‘‘å‰ï |
4ŒŽ22“ú`4ŒŽ25“ú |
IEEE PEDS 2013 |
5ŒŽ29`31“ú |
The 12thInternational Electrical Insulation Conference (INSUCON2013) |
6ŒŽ7“ú |
‘æ33‰ñ≖û•ª‰È‰ïŒ¤‹†”•\‰ï |
6ŒŽ30“ú`7ŒŽ4“ú |
IEEE ICSD Bologna 2013 |
8ŒŽ25“ú`8ŒŽ30“ú |
ISH 2013 |
8ŒŽ27“ú`8ŒŽ29“ú |
•½¬25”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å(B•”–å) ‘å‰ï |
8ŒŽ28“ú`8ŒŽ30“ú |
•½¬25”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å(D•”–å) ‘å‰ï |
9ŒŽ12“ú`9ŒŽ13“ú |
•½¬25”N “d‹CŠw‰ï “d—ÍEƒGƒlƒ‹ƒM[•”–å(A•”–å) ‘å‰ï |
9ŒŽ24“ú`9ŒŽ25“ú |
•½¬25”N“x@(‘æ66‰ñ)@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï |
10ŒŽ20“ú`10ŒŽ23“ú |
2013 IEEE CEIDP |
11ŒŽ11`13“ú |
The 7th IPS International Collaboration Symposium |
11ŒŽ25“ú`11ŒŽ27“ú |
‘æ44‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
12ŒŽ13“ú |
“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
12ŒŽ13“ú`12ŒŽ15“ú |
ISETS'2013 |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ27`28“ú |
•½¬24”N“d‹CŠw‰ï@”¼“±‘Ì“d—͕ϊ·Œ¤‹†‰ï |
3ŒŽ21“ú`23“ú |
•½¬24”N“d‹CŠw‰ï‘S‘‘å‰ï |
6ŒŽ10`13“ú |
2012 IEEE International Symposium on Electrical Insulation (ISEI2012) |
7ŒŽ8`12“ú |
The International Conference on Electrical Engineering 2012(ICEE2012) |
8ŒŽ6`8“ú |
•½¬24”N“d‹CŠw‰ï@“d—Í‹Zp/“d—ÍŒn“‹Zp‡“¯Œ¤‹†‰ï |
8ŒŽ9“ú`11“ú |
‚ª‚¢‚µƒZƒ~ƒi[ |
8ŒŽ21“ú`23“ú |
•½¬24”N“d‹CŠw‰ï@ŽY‹Æ‰ž—p•”–å‘å‰ï |
9ŒŽ10`12“ú |
‘æ43‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ12`14“ú |
•½¬23”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï |
9ŒŽ20“ú,
21“ú |
•½¬24”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï |
9ŒŽ23`27“ú |
International
Conference on Condition Monitoring and Diagonosis (CMD)
|
9ŒŽ24“ú,
25“ú |
•½¬24”N@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‰ï |
10ŒŽ13`17“ú |
Conference on
Electrical Insulation and Dielectric Phenomena (CEIDP) |
11ŒŽ16“ú,
17“ú |
International
Workshop on High Voltage EngineeringiIWHVj |
12ŒŽ7“ú |
•½¬24”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
12ŒŽ18“ú |
•½¬24”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ27“ú,@28“ú |
•½¬23”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï |
2ŒŽ23“ú |
•½¬23”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP|ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ16“ú`18“ú |
•½¬23”N“d‹CŠw‰ï‘S‘‘å‰ï |
6ŒŽ5`8“ú |
2011 Electrical Insulation Conference (EIC2011) |
6ŒŽ17“ú |
‘æ31‰ñ≖û•ª‰È‰ïŒ¤‹†”•\‰ï |
7ŒŽ4“ú, 5“ú |
•ú“dEÃŽ~ŠíEŠJ••ی쇓¯Œ¤‹†‰ï |
7ŒŽ10“ú`14“ú |
International Conference on Electrical Engineering (ICEE) |
7ŒŽ17`19“ú |
2011 International Conference on Electrical Engineering and Informatics
(ICEEI2011) |
8ŒŽ9“ú`11“ú |
‚ª‚¢‚µƒZƒ~ƒi[ |
8ŒŽ22“ú`26“ú |
International Symposium on High Voltage Engineering (ISH) |
8ŒŽ30“ú`9ŒŽ1“ú |
•½¬23”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï |
9ŒŽ6“ú`8“ú |
•½¬23”N“d‹CŠw‰ï@ŽY‹Æ‰ž—p•”–å‘å‰ï |
9ŒŽ6“ú`11“ú |
2011 International Symposium on Electrical Insulating Materials (ISEIM 2011) |
9ŒŽ21“ú, 22“ú |
•½¬23”N@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï |
9ŒŽ26“ú, 27“ú |
•½¬23”N@“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‰ï |
11ŒŽ10`11“ú |
•½¬23”N“d‹CŠw‰ï@•ú“d/ŠJ••یì/‚“dˆ³ ‡“¯Œ¤‹†‰ï |
12ŒŽ13“ú |
•½¬23”N“d‹CŠw‰ï —U“dEâ‰Þ—¿Œ¤‹†‰ï |
12ŒŽ14“ú |
•½¬23”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ29“úC30“ú |
•½¬21”N“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ï |
2ŒŽ19“ú |
•½¬21”N“d‹CŠw‰ï@—U“dEâ‰Þ—¿/“düEƒP[ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ17`19“ú |
•½¬21”N“d‹CŠw‰ï‘S‘‘å‰ï |
6ŒŽ8`11“ú |
20th International Conference on Electricity Distribution |
6ŒŽ22`23“ú |
•½¬21”N“d‹CŠw‰ï@•ú“d^ÃŽ~Ší^ŠJ••ی쇓¯Œ¤‹†‰ï |
7ŒŽ5`9“ú |
The International Conference on Electrical Engineering 2009(ICEE2009) |
7ŒŽ19“ú`23“ú |
The 9th International
Conference on Properties and Applications of Dielectric
Materials(ICPADM2009) |
8ŒŽ18“ú`20“ú |
•½¬21”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï |
8ŒŽ24“ú`28“ú |
16th International Symposium
on High Voltage Engineering (ISH) |
8ŒŽ26“ú`28“ú |
‘æ40‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
9ŒŽ10“úC11“ú |
•½¬21”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï |
9ŒŽ15`17“ú |
•½¬21”N“d‹CŠw‰ï@“d—Í‹Zp^“d—ÍŒn“‹Zp‡“¯Œ¤‹†‰ï |
9ŒŽ28“úC29“ú |
•½¬21”N“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‰ï |
10ŒŽ26`30“ú |
IEEE Transmission&Distribution Conference in Asia 2009 |
10ŒŽ18`21“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2009) |
11ŒŽ5“úC6“ú |
2009 Korea-Japan Joint
Symposium on Electrical Discharge and High Voltage
Engineering |
11ŒŽ19`20“ú |
•½¬21”N“d‹CŠw‰ï@•ú“d/ŠJ••یì/‚“dˆ³ ‡“¯Œ¤‹†‰ï |
11ŒŽ26`27“ú |
IEEJ-EIT Joint symposium advanced Technology inpower Systems |
12ŒŽ18“ú |
•½¬21”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ24“ú |
“d‹CŠw‰ï@•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³ ‡“¯Œ¤‹†‰ï |
2ŒŽ1“ú |
International Seminar of Doctoral Students on Clean Energy System 2008 |
3ŒŽ19`21“ú |
•½¬20”N“d‹CŠw‰ï‘S‘‘å‰ï@i•Ÿ‰ªH‹Æ‘åŠwF•Ÿ‰ªj |
4ŒŽ21`24“ú |
2008 International Conference
on Condition Monitoring and Diagonosis(CMD
2008)(Beijing,China) |
6ŒŽ23`24“ú |
•½¬20”N“d‹CŠw‰ï@•ú“d^ÃŽ~Ší^ŠJ••ی쇓¯Œ¤‹†‰ï |
6ŒŽ25“ú`27“ú |
‘æ12‰ñ‹@ŠB—v‘f‹Zp“W(M-Tech)
(“Œ‹žƒrƒbƒNƒTƒCƒg) |
7ŒŽ6`10“ú |
The International conference on Electrical Engineering 2008(ICEE2008) |
8ŒŽ6“ú`8“ú |
•½¬20”N“d‹CŠw‰ï@“d—Í‹Zp^“d—ÍŒn“‹Zp‡“¯Œ¤‹†‰ï iŒF–{‘åŠwj |
8ŒŽ21“úA22“ú |
•½¬20”N“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï@iç—tH‹Æ‘åŠwFç—tj |
8ŒŽ27“ú`29“ú |
•½¬20”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–å(‚’mŽs•¶‰»ƒvƒ‰ƒUu‚©‚é‚Û[‚ÆvF‚’m) |
9ŒŽ7`11“ú |
2008 International Symposium on Electrical Insulating Materials (ISEIM2008) |
9ŒŽ16`17“ú |
•½¬20”N“d‹CŠw‰ï@ƒpƒ‹ƒXƒpƒ[/•ú“d‡“¯Œ¤‹†‰ï
(²‰ê‘åŠwF²‰ê) |
9ŒŽ24“ú`25“ú |
•½¬20”N“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‰ï@(‘啪‘åŠwF‘啪) |
9ŒŽ24`26“ú |
•½¬20”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï
(L“‡‘åŠwFL“‡) |
10ŒŽ23“úA24“ú |
•½¬20”N“d‹CŠw‰ï@“dŽqƒfƒoƒCƒX^”¼“±‘Ì“d—͕ϊ·‡“¯Œ¤‹†‰ï
(‹ãBH‹Æ‘åŠwF•Ÿ‰ª) |
10ŒŽ26`29“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2008) |
11ŒŽ4`5“ú |
Joint Technical Meeting on Electrical Discharge Engineering, High Voltage
Engineering, Switch and Protection Engineering, Static Apparatus Engineering,
Power Systems Engineering, Distributed Generation and Power Quality |
11ŒŽ23`25“ú |
14th Asian Conference on Electrical Discharge (ACED2008) |
12ŒŽ12“ú |
•½¬20”N“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï
(“d‹CŠw‰ï–{•”F“Œ‹ž) |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ21`25“ú |
20th IEEE International
Conference on Micro Electro Mechanical Systems (MEMS 2007)
iKobeCJapan) |
2ŒŽ8“ú |
“d‹CŠw‰ï—U“dEâ‰Þ—¿^“düEƒP[ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ15`17“ú |
•½¬19”N“d‹CŠw‰ï‘S‘‘å‰ï@i•xŽR‘åŠwF•xŽRj |
8ŒŽ20`22“ú |
•½¬19”N“d‹CŠw‰ïŽY‹Æ‰ž—p•”–å‘å‰ï@i‘åãH‹Æ‘åŠwF‘åãj |
8ŒŽ26`31“ú |
15th International Symposium
on High Voltage
Engineering(ISH2007),@iLjublJanaCSloveniaj |
8ŒŽ27,28“ú |
•½¬19”N“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï@i‘åã‘åŠwF‘åãj |
9ŒŽ12`14“ú |
•½¬19”N“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï@i”ªŒËH‹Æ‘åŠwFÂXj |
9ŒŽ18,19“ú |
•½¬19”N“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï@i—®‹…‘åŠwF‰«“êj |
10ŒŽ14`17“ú |
IEEE Conference on Electrical
Insulation and Dielectric Phenomena(CEIDP2007), (Vancouver, British
Columbia Canada ) |
11ŒŽ15`17“ú |
2007 Japan-Korea Joint
Symposium on Electrical Discharge and High Voltage Engineering,
(Tokyo, Japan ) |
11ŒŽ21`22“ú |
‘æ38‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€ |
11ŒŽ23`25“ú |
International Symposium on
EcoTopia ScienceiISETS2007j, (Nagoya, Japan ) |
11ŒŽ26, 27“ú |
“d‹CŠw‰ï@•ú“d^ŠJ••یì^‚“dˆ³‡“¯Œ¤‹†‰ï@iL“‡Œ§î•ñƒvƒ‰ƒUFL“‡j |
12ŒŽ13“ú |
“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï@i“d‹CŠw‰ï–{•”F“Œ‹žj |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ26, 27“ú |
“d‹CŠw‰ï@•ú“d^—U“dEâ‰Þ—¿^‚“dˆ³‡“¯Œ¤‹†‰ï@i•Ÿ‰ª‘åŠwF•Ÿ‰ªj |
3ŒŽ3“ú |
“d‹CŠw‰ï—U“d¥â‰Þ—¿E“dü¥ƒP[ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ15`17“ú |
•½¬18”N“d‹CŠw‰ï‘S‘‘å‰ï@i‰¡•l‘—§‘åŠwF‰¡•lj |
4ŒŽ2`5“ú |
International Conference on Condition Monitoring and Diagnosis (CMD2006) |
5ŒŽ14`18“ú |
27th International Power Modulator Symposium and 2006 High-Voltage Workshop
IEEE International Power Modulator Conference |
6ŒŽ26`30“ú |
8th International Conference
on Properties and Applications of Dielectric Materials(ICPADM
2006)@(Bali, Indonesia) |
8ŒŽ21, 22“ú |
•½¬18”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï@iŒF–{‘åŠwFŒF–{j |
9ŒŽ13`15“ú |
•½¬18”N“d‹CŠw‰ï@“d—ÍEƒGƒlƒ‹ƒM[iBj•”–å‘å‰ï@i—®‹…‘åŠwF‰«“êj |
9ŒŽ25`29“ú |
22nd International Symposium
on Discharges and Electrical Insulation in Vaccum(ISDEIV)
2006@(Matue, Japan) |
9ŒŽ28C29“ú |
•½¬18”N“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï@i‹{è‘åŠwF‹{èj |
10ŒŽ12C13“ú |
‘æ37‰ñ@“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€@iç—t‘åŠwFç—tj |
10ŒŽ15`18“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2006) |
10ŒŽ16`18“ú |
13th Asian Conference on
Electrical Discharge (ACED 2006)@(Sapporo, Japan) |
11ŒŽ14`15“ú |
Joint Technical Meeting on Electrical Discharges, Static Apparatus, Switching
and Protecting Engineering and High Voltage Engineering, IEEJ |
12ŒŽ13`15“ú |
“ú–{‹@ŠBŠw‰ï@‘æ15‰ñŒð’ÊE•¨—¬•”–å‘å‰ïiTRANSLOG2006j/‘æ13‰ñ“S“¹‹Zp˜A‡ƒVƒ“ƒ|ƒWƒEƒ€iJ|RAIL2006)
(ìèŽsŽY‹ÆU‹»‰ïŠÙFìè) |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ27, 28“ú |
“d‹CŠw‰ï@•ú“d^—U“dEâ‰Þ—¿^‚“dˆ³‡“¯Œ¤‹†‰ï@i‘ˆî“c‘åŠw‘åŠw‰@F–k‹ãBj |
3ŒŽ17`19“ú |
•½¬17”N“d‹CŠw‰ï‘S‘‘å‰ï@i“¿“‡‘åŠwF“¿“‡j |
6ŒŽ5`9“ú |
2005 International Symposium
on Electrical Insulating Materials(ISEIM2005)@(Kitakyushu,
Japan) |
8ŒŽ8`9“ú |
International Symposium on EcoTopia Science 2005 |
8ŒŽ10`12“ú |
•½¬17”N“d‹CŠw‰ï@“d—̓Gƒlƒ‹ƒM[•”–å‘å‰ï@i‘åã‘åŠwF‘åãj |
8ŒŽ22, 23“ú |
•½¬17”N“d‹CŠw‰ï@Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï@i“ú–{‘åŠwF“Œ‹žj |
8ŒŽ25`29“ú |
14th International Symposium
on High Voltage Engineering,@(Beijing, China) |
9ŒŽ29, 30“ú |
•½¬17”N“x“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï@i•Ÿ‰ªH‹Æ‘åŠwF•Ÿ‰ªj |
10ŒŽ16`19“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2005) |
11ŒŽ3, 4“ú |
2005 Korea-Japan Joint
Symposium on Electrical Discharge and High Voltage
Engineering@(Ansan, Korea) |
11ŒŽ9, 10“ú |
“d‹CŠw‰ï@•ú“d^ŠJ••یì^‚“dˆ³‡“¯Œ¤‹†‰ï@iƒTƒ“ƒ|[ƒgƒz[ƒ‹‚¼F‚¼j |
12ŒŽ7`9“ú |
“ú–{‹@ŠBŠw‰ï@‘æ14‰ñŒð’ÊE•¨—¬•”–å‘å‰ï@iìèŽsŽY‹ÆU‹»‰ïŠÙFìèj |
12ŒŽ14“ú |
“d‹CŠw‰ï@ÃŽ~ŠíŒ¤‹†‰ï@i“d‹CŠw‰ï–{•”F“Œ‹žj |
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@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ22“ú |
“d‹CŠw‰ï•ú“dA—U“dEâ‰Þ—¿‚“dˆ³Œ¤‹†‰ïi—®‹…‘åŠwF‰«“êj |
1ŒŽ27“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿^“düEƒP[ƒuƒ‹‡“¯Œ¤‹†‰ï |
3ŒŽ17`19“ú |
“d‹CŠw‰ï‘S‘‘å‰ïiÂŽRŠw‰@‘åŠwF‘Š–ÍŒ´j |
3ŒŽ27`28“ú |
International Workshop on Insulation Diagnosis for Rotating Machines (IDRM) |
3ŒŽ28`4ŒŽ2“ú |
International Symposium on Gaseous Dielectrics X |
6ŒŽ25“ú |
“d‹CŠw‰ï—U“dEâ‰Þ—¿Œ¤‹†‰ï
(–k‹ãB‘Û‰ï‹cêF•Ÿ‰ª) |
8ŒŽ5`7“ú |
“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ïi–¼ŒÃ‰®‘åŠwFˆ¤’mj |
8ŒŽ29`31“ú |
“d‹CŠÖŒWŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïiå‘ä‘ÛƒZƒ“ƒ^[F‹{éj |
9ŒŽ9“ú |
“d‹CŠw‰ï@“d‹C‹ZpŽjŒ¤‹†‰ï |
9ŒŽ19`22“ú |
2004 IEEE International Symposium on Electrical Insulation (ISEI2004) |
9ŒŽ27`28“ú |
“d‹CŠÖ˜AŠw‰ï‹ãBŽx•”˜A‡‘å‰ïiŽŽ™“‡‘åŠwFŽŽ™“‡j |
10ŒŽ7, 8“ú |
International Workshop on
High Voltage Engineering (IWHV'04)@(Sapporo, Japan) |
10ŒŽ17`20“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2004) |
10ŒŽ31`11ŒŽ3“ú |
International Conference on Electrical Machines and Systems 2004 (ICEMS2004) |
11ŒŽ17, 18“ú |
‘æ35‰ñ“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€@iŽÅ‰YH‹Æ‘åŠwF“Œ‹žj |
11ŒŽ19`22“ú |
12th Asian Conference on
Electrical Discharge (ACED2004)@(Shenzhen,
China) |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ22,23“ú |
IWHV(•Ÿ‰ª) |
3ŒŽ11“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
3ŒŽ17`19“ú |
“d‹CŠw‰ï‘S‘‘å‰ï(“Œ–kŠw‰@‘åŠw) |
6ŒŽ1`5“ú |
ICPADM(–¼ŒÃ‰®) |
8ŒŽ6`8“ú |
“d‹CŠw‰ï“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï(“Œ‹ž“d‹@‘åŠw) |
8ŒŽ25`26“ú |
“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï(’·‰ª‹Zp‰ÈŠw‘åŠw) |
8ŒŽ25`29“ú |
ISH(ƒIƒ‰ƒ“ƒ_@ƒfƒ‹ƒtƒg) |
9ŒŽ3`5“ú |
3rd IASTED International Conference Power and Energy Systems (Euro PES) |
9ŒŽ24“ú |
‘æ4‰ñ‹ãBE“d—Í‹ZpŒ¤‹†‰ï(‹ãB“d—Í‘‡Œ¤‹†Š) |
9ŒŽ26`27“ú |
“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ï(’é‘åŠwFŒF–{) |
11ŒŽ6`7“ú |
JKƒVƒ“ƒ|ƒWƒEƒ€(’·è) |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ31“ú`2ŒŽ1“ú |
•ú“d/—U“dEâ‰Þ—¿/‚“dˆ³‡“¯Œ¤‹†‰ïi’·è‘åŠwF’·èj |
3ŒŽ5“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
3ŒŽ26“ú`29“ú |
“d‹CŠw‰ï‘S‘‘å‰ï(“Œ–kŠw‰@‘åŠw) |
4ŒŽ |
2002 Doble Client Conference |
4ŒŽ7`10“ú |
2002 IEEE International Symposium on Electrical Insulation (ISEI2002) |
7ŒŽ |
International Workshop on Insulation Diagnosis for Rotating Machines |
8ŒŽ7“ú`9“ú |
“d—ÍEƒGƒlƒ‹ƒM[•”–å‘å‰ï |
9ŒŽ11“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
9ŒŽ11`13“ú |
Šî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ï |
9ŒŽ20“ú |
‹ãBE“d—Í‹ZpŒ¤‹†‰ï |
9ŒŽ26,27“ú |
‹ãBŽx•”‘å‰ï |
10ŒŽ20`24“ú |
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP2002) |
11ŒŽ7,8“ú |
•ú“dŒ¤‹†‰ï |
11ŒŽ14,15“ú |
≃Vƒ“ƒ|ƒWƒEƒ€ |
11ŒŽ17,18“ú |
KJ
ƒVƒ“ƒ|ƒWƒEƒ€ |
12ŒŽ13“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
1ŒŽ25`26“ú |
“d‹CŠw‰ï@•ú“d,—U“dEâ‰Þ—¿,‚“dˆ³‡“¯Œ¤‹†‰ï |
2ŒŽ27“ú |
“d‹CŠw‰ï@—U“dEâ‰Þ—¿Œ¤‹†‰ï |
3ŒŽ21`23“ú |
“d‹CŠw‰ï‘S‘‘å‰ïi–¼ŒÃ‰®‘åŠwFˆ¤’mj |
5ŒŽ21`25“ú |
International Symposium on Gaseous Dielectrics IX |
8ŒŽ1`3“ú |
“d‹CŠw‰ï“d—̓Gƒlƒ‹ƒM[•”–å‘å‰ïi“Œ–k‘åŠwF‹{éj |
8ŒŽ1`4“ú |
2001 Asia-pacific Radio Science Conference (AP-RASCf01) |
8ŒŽ20`26“ú |
ISH (ƒCƒ“ƒh) |
9ŒŽ21`23“ú |
“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïiˆ¤•Q‘åŠwFˆ¤•Qj |
10ŒŽ5`6“ú |
“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïi²‰ê‘åŠwF²‰êj |
11ŒŽ1`2“ú |
JKƒVƒ“ƒ|ƒWƒEƒ€i‹{èŒö—§‘åŠwF‹{èj |
11ŒŽ8`9“ú |
•ú“dŠw‰ïCŽáŽèƒZƒ~ƒi[i‚¤‚݂̒†“¹ƒzƒeƒ‹F•Ÿ‰ªj |
11ŒŽ8`9“ú |
IWHVi’¹Žæj |
11ŒŽ8`9“ú |
“d‹CŠw‰ï@•ú“d^ŠJ••یì^‚“dˆ³‡“¯Œ¤‹†‰ï |
11ŒŽ19`22“ú |
2001 International Symposium
on Electrical Insulating
Materialsi•ºŒÉj |
12ŒŽ |
“d‹CŠw‰ï@‹ãBŽx•”‰«“êŽxŠu‰‰‰ï |
@“ú@•t@ |
@Šw@‰ï@–¼@ |
3ŒŽ21`24“ú |
“d‹CŠw‰ï‘S‘‘å‰ïi“Œ‹žH‹Æ‘åŠwF“Œ‹žj |
4ŒŽ2`5“ú |
ISEI2000iAnaheim,
CAFUSAj |
4ŒŽ10`12“ú |
IHVW2000inewport bearch,
CAFUSAj |
6ŒŽ21`26“ú |
ICPADMiX'ian Jiaotong
UniversityF’†‘j |
7ŒŽ24`28“ú |
ICEE2000i–k‹ãB‘Û‰ï‹cêF•Ÿ‰ªj |
8ŒŽ2`4“ú |
“d‹CŠw‰ï“d—̓Gƒlƒ‹ƒM[•”–å‘å‰ïi–kŠC“¹‘åŠwF–kŠC“¹j |
9ŒŽ7`8“ú |
“d‹CŠw‰ïŠî‘bEÞ—¿E‹¤’Ê•”–å‘å‰ïi–kŠC“¹‘åŠwF–kŠC“¹j |
9ŒŽ13`14“ú |
“d‹CŠÖŒWŠw‰ï‹ãBŽx•”˜A‡‘å‰ïi‹ãBŽY‹Æ‘åŠwF•Ÿ‰ªj |
9ŒŽ18`23“ú |
ISDEIViX'ian Jiaotong
UniversityF’†‘j |
10ŒŽ5`6“ú |
JKƒVƒ“ƒ|ƒWƒEƒ€iŠØ‘j |
10ŒŽ15`17“ú |
‰F’ˆ‰ÈŠw‹Zp˜A‡u‰‰‰ïiƒAƒNƒƒX•Ÿ‰ªF•Ÿ‰ªj |
11ŒŽ1`2“ú |
IWHVi’¹Žæj |
11ŒŽ6`7“ú |
10th Asian Conference on Electrical Discharge (ACED2000) |
11ŒŽ16`17“ú |
“d‹C“dŽqâ‰Þ—¿ƒVƒXƒeƒ€ƒVƒ“ƒ|ƒWƒEƒ€iŽR‰¤‹¤Ï‰ïŠÙF’·–ìj |
12ŒŽ15“ú |
“d‹CŠw‰ï“dŽ¥ŠÂ‹«Œ¤‹†‰ïi–¼ŒÃ‰®H‹Æ‘åŠwFˆ¤’mj |
|